• Solar Silicon Wafer - Monocrystalline Grade System 1
  • Solar Silicon Wafer - Monocrystalline Grade System 2
  • Solar Silicon Wafer - Monocrystalline Grade System 3
Solar Silicon Wafer - Monocrystalline Grade

Solar Silicon Wafer - Monocrystalline Grade

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Loading Port:
Shanghai Port
Payment Terms:
TT or LC
Min Order Qty:
100Pieces PCS
Supply Capability:
700 MW/Per Year PCS/month

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Specification of Mono Silicon Wafers

 

We can provide you solar wafer both156*156 and 125*125mm, Mono and Poly

Solar Wafers for your raw materials choice.

Product name  Mono Wafer
 Conductive type  P type
 Square size wafer(mm)  156×156±0.5 
 Resistivity range 1~3 ohm
 Corner(mm) 150±0.5;165±0.5 
  195±0.5;200±0.5
 Thickness (μm) 200±20 
 Total thickness(um) ≤ 30     
Resistivity range(Ωcm) 1-3
 Doping elements Boron
 Orientation (100)±1° 
Carbon content(atoms/cc) ≤1.0E+17 
 Oxygen content(atoms/cc) ≤1.0E+18 
 Lifetime(μs) ≥10 
 Surface quality  No crack, gap, missing Angle, perforated, silicon fell and stress
  Warping degrees(warp/μm) ≤50 
  Neighbouring vertical degree 90±0.5° 
Side damage(mm)   ≤0.5mm(length)×0.3mm(width)(not more than 2 per wafer)
Line mark(μm) ≤15

Usage and Applications of Mono Solar Wafers

Mono Solar Wafers mainly used in Solar Cells with reliable quality and trustful efficiency performance. Our Wafers should be your best choice for raw materials.

 

Packaging & Delivery of Mono Solar Wafers

Carton Box Package and Deliver by air. It should be avoid of moist, water and shaking to protect the safety of Solar Cells.

 

Factory Picture of Mono Solar Wafers

 

 Solar Wafers

 

Package Picture of Mono Solar Wafers

 Solar Wafers

Q: How are solar silicon wafers interconnected to form solar modules?
Solar silicon wafers are interconnected to form solar modules through a process called solar cell stringing. In this process, multiple silicon wafers are connected in series using metal conductive ribbons. The ribbons are soldered onto the front and back contacts of the adjacent wafers, creating an electrical pathway between them. This interconnection enables the flow of current generated by the individual solar cells, allowing them to work together efficiently and produce electricity.
Q: Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon. What are the most commonly used methods. Loss big? Thank you
Wire cutting equipment, NTC, HCT these two brands are relatively large
Q: Monocrystalline silicon processing technology
Wafer thickness is also a factor in productivity, as it relates to the number of wafers produced by each silicon block. The ultrathin wafer presents additional challenges to the wire technology, because the production process is much more difficult to. In addition to the mechanical brittleness of silicon wafers, if the wire sawing process no precise control, slight crack and bending will have negative effects on product yield. The system must be of ultra-thin silicon wire technology, linear cutting line speed and pressure, and precise control of cutting coolant.Regardless of the thickness of the silicon wafer, crystal silicon solar cell manufacturers have made great demands on the quality of the silicon wafer. The wafer cannot have surface damage (minor cracks, wire mark), morphology defects (bending, convex, uneven thickness) to minimize additional back-end processing such as polishing and other requirements to a minimum. Current situationIn order to meet the market for lower cost and higher productivity, a new generation of wire must improve the cutting speed, the use of silicon longer so as to improve the cutting load. Thinner cutting lines and thinner silicon chips increase productivity, while advanced process control can manage cutting line tension to keep the cutting line firm.
Q: Development trend of monocrystalline silicon wafer
The development of science and technology is driving the development of semiconductors. With the development of automation and computer technology, the cost of this kind of high technology product of silicon chip (integrated circuit) has been reduced to a very low level. The price of a mini computer is only a few hundred yuan. This paved the way for the computer to enter thousands of households. Make our life more and more modern.Of course, the changes in the chip to the family is far more than that, with the increase in the number of electronic households, a new production lifestyle - "home industry" and "home office" is being produced. In the future, sitting at home operating machines, command production and management companies and factories, will become a reality The day is not too distant when.
Q: How are solar silicon wafers affected by light-induced degradation?
Solar silicon wafers are affected by light-induced degradation in terms of reduced efficiency and performance. This degradation occurs due to the formation of defects and impurities in the silicon material when exposed to intense sunlight over time. As a result, the solar cells on these wafers experience a decrease in power output and a decrease in overall conversion efficiency. This degradation can be mitigated through various techniques, such as using higher-quality silicon, implementing anti-reflection coatings, or incorporating passivation layers to minimize the impact of light-induced degradation.
Q: Can solar silicon wafers be used in solar-powered water desalination?
Yes, solar silicon wafers can be used in solar-powered water desalination. These wafers are commonly used in photovoltaic (PV) panels to convert sunlight into electricity. By utilizing solar silicon wafers, solar-powered desalination systems can harness solar energy to power the desalination process, making it a sustainable and environmentally friendly solution for producing fresh water from seawater.
Q: How are solar silicon wafers cut from a silicon ingot?
Solar silicon wafers are cut from a silicon ingot using a process called wafering. This involves several steps including slicing, lapping, and polishing. Initially, a diamond wire saw is used to slice the ingot into thin wafers. Then, the rough surfaces of the sliced wafers are lapped to remove any imperfections and achieve the desired thickness. Finally, the wafers undergo a polishing process to achieve a smooth and mirror-like surface, which is essential for efficient solar cell production.
Q: How does the efficiency of a solar silicon wafer change over time?
The efficiency of a solar silicon wafer tends to decrease over time due to various factors such as degradation of the materials, exposure to environmental conditions, and the accumulation of dirt or debris on the surface. These factors can lead to a decrease in the wafer's ability to convert sunlight into electricity, resulting in a gradual decline in its efficiency. Regular maintenance and cleaning can help mitigate some of these effects and prolong the lifespan of the solar silicon wafer.
Q: What is the role of emitter diffusion in solar silicon wafers?
The role of emitter diffusion in solar silicon wafers is to create a region with a high concentration of dopant atoms near the surface of the wafer. This creates a p-n junction, which is essential for the efficient conversion of sunlight into electricity in a solar cell. The emitter diffusion process helps to improve the conductivity and collection of charge carriers, thereby enhancing the overall performance of the solar cell.
Q: How is the back surface field created in a solar silicon wafer?
The back surface field in a solar silicon wafer is created by introducing a dopant material, usually boron, to the back surface of the wafer. This dopant material forms a p-type layer, creating a high concentration of positive charge carriers near the surface. This creates a built-in electric field that helps to separate the generated electron-hole pairs towards the front surface of the wafer, improving the efficiency of the solar cell.
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