Solar Mono Silicon Wafer for Solar Cell (156 and 125)

Solar Mono Silicon Wafer for Solar Cell (156 and 125) System 1

Solar Mono Silicon Wafer for Solar Cell (156 and 125)

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Loading Port:: China main port

Payment Terms:: TT or LC

Min Order Qty:: 10000 pc

Supply Capability:: 1000000 pc/month

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1. Structure of Solar Mono Silicon Wafer for Solar Cell (156 and 125) Description

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as acrystalline silicon, used in electronics for the

fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for

microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion

implantation,etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated

(dicing) and packaged.

2. Main Features of the Solar Mono Silicon Wafer for Solar Cell (156 and 125)

• High quality Silicon wafer carrier box

• quartz glass wafer carrier from Taifulong Technology

3. Solar Mono Silicon Wafer for Solar Cell (156 and 125) Images

Solar Mono Silicon Wafer for Solar Cell (156 and 125)

4. Solar Mono Silicon Wafer for Solar Cell (156 and 125) Specification

窗体顶端 Item窗体底端	N-type solar grade mono silicon wafer(125x125mm)	N-type solar grade mono silicon wafer(156x156mm)
Growth Method	CZ	CZ
Conductive Type	N-type	N-type
Dopant	Phos.	Phos.
Orientation	<100>±3°	<100>±3°
Resistivity	1 –3,3-6Ω•cm	1 –3,3-6 Ω•cm
Bulk Lifetime	≥1000μs	≥1000μs
Oxygen Content	≤0.1*10¹⁸ cm³	≤0.1*10¹⁸ cm³
Carbon Content	≤0.1*10¹⁷ /cm³	≤0.1*10¹⁷ /cm³
Dimension	125*125±0.5mm	156*156±0.5mm
Diagonal	150±0.5mm	200±0.5mm
Square Sides Angle	90±0.3°	90±0.3°
Thickness	200±20 um	200±20 um
TTV	≤25um	≤25um
Saw Mark	≤15um	≤15um
Warp	≤40um	≤40um
Chips	Depth<0.3mm;Length<0.5mm	Depth<0.3mm;Length<0.5mm,
Chips	less than 2chips per wafer	less than 2chips per wafer
Appearance	No Stain, No Pinhole and Cracks by Visual Inspection	No Stain, No Pinhole and Cracks by Visual Inspection
Dislocation Density	≤1000 pcs/cm2	≤1000 pcs/cm2
Package	Packed in Polyethylene foam box,400pcs/box	Packed in Polyethylene foam box,400pcs/box 窗体底端

5. FAQ of Solar Mono Silicon Wafer for Solar Cell (156 and 125)

Q1. How long can we receive the product after purchase?

A1.In the purchase of product within three working days, We will arrange the factory delivery as soon as possible. The pecific time of receiving is related to the state and position of customers

Q2. Can we visit your factory?

A2:Surely, I will arrange the trip basing on your business schedule.

Q3:Which payment terms can you accept?

A3:T/T,L/C,Moneygram,Paypal are available for us.

Q: How are solar silicon wafers protected from damage during transportation?: Solar silicon wafers are typically protected from damage during transportation through the use of specialized packaging materials and handling procedures. These wafers are often enclosed in anti-static and shock-absorbing packaging materials such as foam or bubble wrap to prevent any impact or vibration-related damage. Additionally, they are typically stored in sturdy containers or crates to ensure safe transportation and minimize the risk of breakage.

Q: What is the role of surface passivation on solar silicon wafers?: The role of surface passivation on solar silicon wafers is to improve the efficiency and performance of the solar cells. Passivation involves the application of a thin layer of material on the surface of the silicon wafer to reduce surface recombination, which is the loss of electrons and holes at the surface. This helps to minimize the loss of charge carriers and improves the overall electrical properties of the solar cell. By reducing surface recombination, surface passivation increases the conversion efficiency of the solar cell and enhances its ability to generate electricity from sunlight.

Q: How are solar silicon wafers cut from a silicon ingot?: Solar silicon wafers are typically cut from a silicon ingot using a wire saw or a diamond-blade saw. The ingot is first sliced into thin wafers using a wire saw that consists of a continuous loop of wire with diamond particles. The wire saw is guided through the ingot, creating multiple wafers simultaneously. Alternatively, a diamond-blade saw can be used, which involves cutting the ingot into wafers with a rotating blade coated with diamond particles. Both methods ensure precise and clean cuts, resulting in the formation of individual solar silicon wafers.

Q: Can solar silicon wafers be used in solar-powered military applications?: Yes, solar silicon wafers can be used in solar-powered military applications. Solar silicon wafers are a key component in solar panels, which can be utilized to power a variety of military equipment, such as remote surveillance systems, communications equipment, and even portable power sources for soldiers in the field. The use of solar power in military applications offers numerous benefits, including reduced reliance on traditional fuel sources, increased energy efficiency, and enhanced operational sustainability.

Q: Can solar silicon wafers be damaged by hail or other weather conditions?: Yes, solar silicon wafers can be damaged by hail or other severe weather conditions. Hailstones can cause physical impact damage, leading to cracks or fractures on the wafers. Additionally, extreme weather conditions like heavy storms, high winds, or lightning strikes can also pose risks to the integrity of solar panels, including the silicon wafers. It is essential to consider the potential impact of weather conditions and take appropriate measures to protect solar panels from potential damage.

Q: Are solar silicon wafers affected by electromagnetic waves?: Yes, solar silicon wafers are indeed affected by electromagnetic waves. Electromagnetic waves, such as those emitted by radio frequencies or microwaves, can interfere with the performance of solar silicon wafers. This interference can lead to a reduction in the efficiency of the solar cells or even disrupt their operation entirely. As a result, it is crucial to consider electromagnetic interference when designing and installing solar panels to ensure optimal performance and minimize any potential negative impacts.

Q: Can solar silicon wafers be used in portable electronic devices?: Yes, solar silicon wafers can be used in portable electronic devices. They can be incorporated into the design of devices such as solar-powered chargers, solar backpacks, or even solar-powered mobile phones to harness solar energy and provide renewable power on the go.

Q: What does TTV mean in silicon wafer production?: Thickness variation of TTV: wafer. Generally speaking, the thickness of silicon wafer has no effect on the quality of silicon wafer. The only thing that really works in a silicon chip is a thin layer of silicon, and the rest is supported

Q: How do solar silicon wafers perform in high-pollution environments?: Solar silicon wafers are designed to withstand high-pollution environments quite well. The protective coatings on the surface of the wafers help to prevent dirt, dust, and other pollutants from adhering to the surface. Additionally, the rugged construction of the wafers ensures they can handle harsh weather conditions and prolonged exposure to pollutants without significant degradation in performance. However, it is still recommended to regularly clean the solar panels in high-pollution areas to maintain their optimal efficiency.