Aluminum PCB

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The layer: single、double、multilayer

The thickness of the insulating layer：Conventional plate

Flame retardant properties：VO plate

Base material：FR4

Insulation materials: Organic resin

The processing technology: Electrolyticfoil

Q:Engraving machine how to choose the circuit board?: Third, the maximum operating speed refers to the speed of the X, Y axis movement. In fact, the circuit board engraving process, the circuit board engraving machine speed is very low, then why should we emphasize this indicator? A high speed represents the driving ability of the motor, which allows it to move fast, it can make a quick stop, on the other hand also represents the assembly track, screw parallel relationship, small damping, will not affect the accuracy.

Q:What's the difference between PCB and FPC?: FPC: flexible circuit board (flexible PCB): referred to as "soft board", also known as the "flexible circuit board", also known as the "flexible circuit boards, flexible circuit board or flexible circuit board and flexible circuit board, English is" FPC PCB "or" FPCB Flexible and Rigid-Flex ".

Q:What is the raw material of FPC?: 1, flexible circuit board (flexible printed circuit board) flexible circuit board (flexible printed board): English Flexible Printed Circuit, abbreviation FPC, commonly known as soft board. The definition of flexible circuit board IPC-T-50 is a printed circuit board substrate using flexible single-layer, double-layer or multilayer production line, can have a covering layer (solder layer), also can not cover layer (solder layer). GB GB/T2036-94 "printed circuit terminology" 2.11 on flexible printed board (FPC) is explained: the use of flexible substrate made of printed boards, with or without flexible cover.

Q:Can a polyimide copper clad laminate be used as a rigid plate?: Around 2011 I used this material to be applied to rigid plates, mixed with FR4 ordinary sheet.

Q:What are the circuit board materials?: In addition to other special resin (glass fiber cloth, poly amide fibers, non-woven fabrics and other materials to increase): bismaleimide modified three triazine resin (BT), polyimide resin (PI), two phenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), poly isocyanate ester resin, polyolefin resin etc.. According to the classification of CCL flame retardant performance, can be divided into flame retardant (UL94 a VO, UL94 a V1 class) and non flame retardant (UL94 a HB) two kinds of board. In the past one or two years, with the more attention to the environmental protection problem, a new kind of bromine free CCL variety, which is a new type of flame retardant CCL, can be called "green flame retardant cCL". With the rapid development of electronic technology, cCL has higher performance requirements. Therefore, from the performance of the CCL classification, is divided into the general performance of CCL, low dielectric constant CCL, high heat resistance of the CCL (general board of L above 150 degrees Celsius), low thermal expansion coefficient of CCL (commonly used for packaging substrate) and other types.

Q:How much is the warpage of the circuit board, and how to detect the warpage of the FPC?: According to the United States IPC-6012 (1996 edition) rigid printed board identification and performance specification, flexible circuit board for surface mount printed board to allow maximum warpage and distortion of 0.75%, the other various boards allow for the use of 1.5%.

Q:What are the circuit board display devices?: The circuit board is mainly composed of the pad, the hole, the mounting hole, the wire, the components, the connector, the filling, the electrical boundary and so on

Q:Why do you need UL certification?: So far, there have been more than 2 thousand PCB board manufacturers successfully obtained UL certification, which is the majority of rigid circuit board.

Q:What materials are needed in PCB plant?: There are many kinds of classification methods of copper clad laminate. According to the general board reinforced with different materials can be divided into: paper base, glass fiber cloth, composite base (CEM Series), build up multilayer plate base and special material (ceramic, metal core based) five categories. According to the different resin adhesive used in the classification, the common paper based CCI. There are: phenolic resin (XPc, XxxPC, FR 1, FR 2, etc.), epoxy resin (FE a 3), polyester resin and other types. Glass cloth CCL common epoxy resin (FR 4, FR 5), it is the most widely used type of glass fiber cloth at. In addition to other special resin (glass fiber cloth, poly amide fibers, non-woven fabrics and other materials to increase): bismaleimide modified three triazine resin (BT), polyimide resin (PI), two phenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), poly isocyanate ester resin, polyolefin resin etc..

Q:Several kinds of circuit boards: In addition to other special resin (glass fiber cloth, poly amide fibers, non-woven fabrics and other materials to increase): bismaleimide modified three triazine resin (BT), polyimide resin (PI), two phenylene ether resin (PPO), maleic anhydride imide - styrene resin (MS), poly isocyanate ester resin, polyolefin resin etc..

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